Outstanding Features:

• Compact table-top size with cooling unit achieves rapid cooling from +200° to +20°C
• No liquid coolants are required.
• ThermoChuck provides:
  • Electrical isolation : 109 ohms at 500 VDC between surface and ground at +25°C; Higher Isolation configurations available
  • Precise temperature accuracy : ±0.5°C (calibrated against transfer standard)
  • Surface Flatness: .025mm TIR up to +100°C; .05mm TIR up to +200°C
  • Superior temperature uniformity (±0.5°C or ±0.5% of set temperature (whichever is greater.))
  • Excellent temperature stability: ±0.1°C
  • High isolation and guarded ( low leakage) configurations available
• DC Power minimizes electrical noise; special "inhibit power" feature further eliminates noise.

Standard Features:

• Ramp/soak/cycle programming is controllable from front panel display or via remote interface
• IEEE-488 and RS232 remote interface is included.
• Interfaces to most major wafer probing stations, laser trimmers and inspection stations.
• 3 operating modes: manual , auto and remote
• Protection from excessive high temperature for DUT and System
• Certified Compliant  

Applications:

• Thermal cycling and steady- state thermal testing of wafers, hybrids and other flat devices from +20°C to +200°C
• Low noise test applications
• High isolation and guarded ( low leakage) applications
• Thermal characterization of standard and high power devices
• Control at +20°C ±0.1°C even for local probing ambient of +40°C

See the TP03020B ThermoChuck Datasheet

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